About The Role
A*STAR Institute of Microelectronics (IME) is seeking a highly motivated Scientist / Senior Scientistto conduct R&D in thermal management, heat dissipation, and advanced cooling technologies fornext-generation semiconductor packaging. The successful candidate will develop innovativethermal solutions for heterogeneous integration, AI/HPC packages, chiplets, 2.5D/3D integration,power electronics, and photonics applications.
This role involves adopting advanced thermal/cooling concepts into package technologies through close collaboration with multidisciplinary teams in materials, packaging integration, reliability,simulation, and industry partners. He/she focuses on practical execution of thermal R&D activities,including simulation, testing, data analysis, prototype evaluation, and implementation of innovativethermal solutions for next-generation packages such as AI/HPC, chiplet, 2.5D/3D integration,photonics, and power electronics.
Key Responsibilities
- Thermal Project Execution: To execute thermal engineering tasks for grant and/or customer-funded R&D projects. To Support project deliverables, timelines, experiments, and reporting. ToPerform package thermal assessments and identify hotspot / cooling issues. To Generate technicaldata, reports, and presentation materials.
- Thermal Simulation & Analysis: To conduct thermal modelling using tools such as ANSYSIcepak, ANSYS Fluent COMSOL Multiphysics and SIEMENS Flotherm. To perform steady-stateand transient thermal simulations, junction temperature prediction and thermal resistanceextraction, and thermal design optimization
- New Cooling Technology Development: To support development and validation of newcooling concepts, including microchannel cooling, vapor chamber integration, immersion coolingand high-performance TIMs. To build prototypes and conduct proof-of-concept testing.
- Thermal Characterization & Lab Work: To perform laboratory thermal measurements with IRthermography, thermocouple, thermal transient testing and flow / pressure drop testing. To correlatemeasured data with simulation results.
- Cross-functional Collaboration: to work with package design, process integration, materials,and reliability teams. To support customer technical discussions and project reviews. To contributeto publications, patents, and technical proposals.
Requirements
- PhD / master’s degree in mechanical engineering, materials science, electrical engineering,microelectronics, thermal sciences and related disciplines.
- 2+ years’ work experience in thermal management for semiconductor packaging preferred.
- Strong background in semiconductor package thermal design, electronics cooling, CFD /thermal modeling, experimental thermal characterization and materials for heat dissipation
- Strong understanding of heat transfer, fluid mechanics, semiconductor packaging flows andAI/HPC package challenges
- Experience in simulation tools and data analytics.
- Familiarity with JEDEC standards is advantageous.
- Strong communication and technical presentation skills.
- Strong industry engagement mindset.
